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Frequent questions

  • [FAQ] TDA4VM: How to address the assertion Issue from EthFw, due to race condition between multiple client requests for EnetMcm Module Server Task.

    Part Number: TDA4VM How to address the assertion Issue from EthFw, due to race condition between multiple client requests for EnetMcm Module Server Task.

  • [FAQ] AM625 / AM623 Custom board hardware design - Design and Review notes for Reuse of SK-AM62B Schematics

    Part Number: AM625 Other Parts Discussed in Thread: SK-AM62B , SK-AM62B-P1 , Hi TI Experts, I am starting a new board design and planning to use TI Starter Kit (SK) design files for designing my custom board. https://www.ti.com/tool/SK-AM62B Please let…

  • [FAQ] AM6442: SERDES Common Mode Voltage, Seeing 400mv centerpoint in simulation

    Part Number: AM6442 Hello, I am trying to understand what voltage levels I am looking at with the AM6442 SERDES driver. I am using the IBIS-AMI model in HYPERLYNX I am seeing the common mode output voltage swing from 200 to 600 mV with a centerpoint…

  • [FAQ] AM6x: Optimizing SPI-transfer inter-byte gaps using the DMA in Linux

    Part Number: AM625 Other Parts Discussed in Thread: SK-AM62B , Overview In some applications it is critical that SPI transfers happen with the smallest-possible inter-byte gaps to either optimize throughout, or to meet certain overall system real-time…

  • [FAQ] AM6x: Using a custom device tree file for booting the Linux Kernel with TI's Yocto SDK v9.x

    Part Number: AM625 Other Parts Discussed in Thread: SK-AM62 , , SK-AM62B Overview It is a common need wanting to incorporate a custom Linux device tree file into the boot process of Yocto-generated filesystem images. This FAQ introduces a simple and basic…

  • [FAQ] AM623: LPDDR4 Padstack size

    Part Number: AM623 Hello, I'm referring to PROC124E2A AM62x-LOW POWER SKEVM, which uses MT53E1G16D1FW-046 WT:A LPDDR4. According to datasheet the size of the solderballs should be 0.436mm and PCB board uses 13mils(0.3302mm). Also, if you see the spacing…

  • [FAQ] TDA4VL-Q1: CDD IPC App example running on MCU1_0 communicating with another R5 core

    Part Number: TDA4VL-Q1 Hello, Can you support in extending CDD IPC app example to run on MCU1_0 communicating with MCU2_0 core ? Regards

  • [FAQ] TDA4AH-Q1: CDD IPC App example running on MCU1_0 communicating with another R5 core

    Part Number: TDA4AH-Q1 Hello, Can you support in extending CDD IPC app example to run on MCU1_0 communicating with MCU2_0 core ? Regards

  • [FAQ] AM6442: CLKOUT0 feedback to RMII_REF_CLK always necessary?

    Part Number: AM6442 Hello Sitara team, my customer is working with AM6442 and two Ethernet PHYs ADIN1200 (100Mbit) and ADIN1300 (1Gbit). They would like to use CLKOUT of the AM64 with 25MHz to connect to the 100Mbit PHY. However in the datasheet it mentions…

  • [FAQ] J721S2XSOMXEVM: How to unlock the JTAG using TISCI API ?

    Part Number: J721S2XSOMXEVM How we can unlock the JTAG on HS-SE devices using TISCI api mentioned in the secure debug document ?

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