Texas Instruments (TI) Processors support forum is an extensive online knowledge base where millions of technical questions and solutions are available 24/7. You can search processors content or ask technical support questions on Sitara™ processors, digital signal processors (DSP) and automotive processors. Find the right solution for your circuit design challenges by using our TI E2E™ support forums that are supported by thousands of contributing TI experts.
Frequent questions

  • [FAQ] TDA4VM: How to use VPAC-LDC to upscale images? (TDA4x/AM6xA)

    Part Number: TDA4VM VPAC-LDC H/W can be used for simple image upscaling as well as downscaling, while VPAC-MSC only supports downscaling. To program LDC for upscaling, we need to reduce the affine transform matrix elements A and E from their default…

  • [FAQ] AM62Lx, AM62x, AM62Px, AM62Dx, AM62Ax, AM64x, AM243x : Sitara MPU GUI Based Tools

    Following is a consolidated list of all the tools currently available on the https://dev.ti.com/gallery/ The list continues to expand as we build self-helper tools on recurring challenges.

  • [FAQ] TDA4VH-Q1: How do I build firmware and replace it in a Yocto build?

    Part Number: TDA4VH-Q1 I have built specific firmwares for my applications, and I need to replace the firmware pulled into my Yocto build. How do I do this?

  • [FAQ] How to sign JTAG unlock certificate with the imported keyring key on AM6xx

    Part Number: AM625 SYSFW/TIFS supports keyring import on AM6xx SoC https://software-dl.ti.com/tisci/esd/latest/6_topic_user_guides/keyring.html https://software-dl.ti.com/tisci/esd/latest/2_tisci_msgs/security/keyring.html The imported key can be…

  • [FAQ] How to boot SK-AM62B via Ethernet

    Part Number: AM625 Other Parts Discussed in Thread: SK-AM62B This FAQ goes over how to boot the EVM into the u-boot environment via Ethernet, then fully boot the EVM with either DHCP/TFTP or eMMC. This FAQ is divided into 3 sections How to boot…

  • [FAQ] AM6442: Enabling SOP8 208mil and SOP16 300mil Co-Layout for Winbond Flash in a Single PCB Design

    Part Number: AM6442 Just a quick information share for anyone who may encounter a similar situation. I recently heard from a designer working on an AM6442-based project who faced a PCB layout challenge due to component sourcing flexibility requirements…

  • [FAQ] J784S4XEVM: RAT configuration for Jacinto platforms

    Part Number: J784S4XEVM RAT configuration from simple example

  • [FAQ] 3D CNN / Pooling TO 2D CONVERSION FOR TIDL

    Part Number: PROCESSOR-SDK-RTOS-J784S4 OVERVIEW TIDL's C7x DSP only runs 2D convolution and 2D pooling. This tool rewrites Conv3D, MaxPool3D, and AveragePool3D nodes in an ONNX model into equivalent sequences of 2D operations. The conversion is mathematically…

  • [FAQ] AM625: errata i2493 potential of eMMC write failures fix

    Part Number: AM625 Background: i 2493 MMCSD: HS200 write failures Details: The MMC0 interface has the potential for write failures when issuing multiple block writes operating in HS200 mode with excessive IO supply noise. To minimize IO supply noise…

  • [FAQ] J784S4XEVM: Automatic Mixed Precision Runs Very Slowly and Generates Large Intermediate Files

    Issue When running Automatic Mixed Precision (AMP) with TIDL, users may observe: - AMP runs for an extremely long time without completing - Hundreds of gigabytes of intermediate trace files accumulate on disk Root Cause AMP works by running the…

View FAQ threads
  • Threads 204461 Discussions