A collection of interesting, possibly useful techniques... click any picture to enlarge.
This page is referenced in this blog that discusses the challenges of prototyping with micro-sized package types.
A breadboard designed specifically for power op amp circuitry.
A low noise circuit built on the top of quart paint can used for shielding. I/O connections made through connections through the top.
Battery power source permanently attached to the top of a gallon paint can. Power connections can be made to low noise circuitry placed inside the can. Two BNC connectors allow I/O to outside.
Small circuit is enclosed in a box made from blank circuit board material. Tack soldering holds the box together. For real high frequency shielding, box must soldered along all edges.
High frequency circuit air-wired on blank circuit board for ground plane.
High frequency circuit on a universal board.
Matt is not particularly proud of this motor control breadboard. Looks better than some of mine.
Paul in Scotland provided these ideas: Prototyping designs was a problem for me also until about 6 years ago when I realised that 0.1” strip straddles 1.27mm pitch ICs. So you will see from the attached photo I build on the copper side of strip board and use a scalpel to cut the soft copper tracks in two. I hook up the connections under a microscope, X3 magnification is sufficient, and use burn through insulated single core wire ( 30awg wire wrapping wire ). SOT23 packages mount easily on the strip board as well. I have used this technique on soft single sided Cu clad board with 0.6mm pitch ICs - I wouldn’t recommend though since I had to cut the tracks freehand!
Susan in London has done some intricate improvising of fine-pitch audio d/a converters on 0.1" spaced breadboard. They are driving DIP op amp circuitry (not shown). With excellent circuit design careful implementation, she was able to achieve exceptional performance. Commenting on the construction, Susan says, "It is quite fiddly however the most important thing is that one needs a good fine tip soldering iron (I use a Weller WSP80)." And, I will add to that... one needs good eyes and a steady hand!
Reader, Jon, provided this clever technique: TI has a nice series of LaunchPad MCU evaluation boards with pins on 0.1-inch centers along two sides. But the two rows don't have sufficient space between them to insert in two breadboards. Aaargh! I solved that problem by cutting a breadboard in half (lengthwise), and plugging the LaunchPad pins into the separate pieces. This "technique" applies to other MCY evaluation and development boards, too.
Reader Paolo was kind enough to share his own adapter board design that he has made for other package types. A zip file of the Gerber files is below. Thanks Paolo!
7002.Paolo's Gerber files.zip
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