Other Parts Discussed in Thread: AM62D-Q1, AM62A3, , AM62A3-Q1, , SK-AM62A-LP, SYSCONFIG
Hi TI Experts,
Can you provide a List of collaterals that can be referred when starting a custom board hardware design.
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Hi Board designers,
The below links are a quick reference to the collaterals that can be referred when starting a custom design.
Device Selection and features
Product Pages
https://www.ti.com/product/AM62A7
https://www.ti.com/product/AM62A7-Q1
Datasheet
AM62Ax Sitara Processors datasheet
https://www.ti.com/lit/pdf/sprsp77
Silicon Errata
AM62Ax Sitara Processors Silicon Errata, Silicon Revision 1.0
https://www.ti.com/lit/pdf/sprz544
Technical Reference Manual (TRM)
AM62Ax Sitara Processors Technical Reference Manual
https://www.ti.com/lit/pdf/spruj16
Custom Board design:
Hardware Design Considerations
Custom Board Hardware Design Considerations for AM62A3, AM62A7-Q1 and AM62D-Q1 Processor Families
https://www.ti.com/lit/pdf/sprad85
Schematic Design and Review Checklist
For AM62x processor families
AM62x, AM62Ax, AM62D-Q1 and AM62Px Processor Families Schematic, Design Guidelines and Review Checklist
https://www.ti.com/lit/pdf/sprad21
For AM62Ax and AM62Dx Processor Families
AM62A7, AM62A7-Q1, AM62A3-Q1 and AM62D-Q1 Families Schematic, Design Guidelines and Review Checklist
https://www.ti.com/lit/pdf/sprado2
Power Consumption
AM62Ax Maximum Current Ratings
https://www.ti.com/lit/pdf/sprada7
AM62A Power Estimation Tool
https://www.ti.com/lit/pdf/sprad93
Evaluation - EVM
https://www.ti.com/tool/SK-AM62A-LP
SK-AM62A-LP Design File Package
https://www.ti.com/lit/zip/sprr491
Board Dimensions 2D
https://e2e.ti.com/cfs-file/__key/communityserver-discussions-components-files/791/0246.PROC135E2_5F00_BRD.dxf
7028.PROC135E2_BRD_Dimension.pdf
Board Stackup
3D CAD
PinMux
Schematics (Reference) for RMII interface
Note: We did functionally validate the common clock configuration. No other clocking options were tested.
Ethernet PHY daughter card
https://www.ti.com/tool/DP83867-EVM-AM
https://www.ti.com/tool/DP83826-EVM-AM2
https://www.ti.com/tool/TIDA-00928
There seems to be a muxed GPMC interface implemented.
https://media.digikey.com/pdf/Data%20Sheets/Texas%20Instruments%20PDFs/TMDXICE3359_SCH.pdf
CAD symbols
Cad symbol specific to the selected device can be chosen from the device product page. Refer below example.
https://www.ti.com/product/AM62A7#cad-cae-symbols
Ordering & quality
https://www.ti.com/product/AM62A7#order-quality
https://www.ti.com/product/AM62A7-Q1#order-quality
Package pad diameter and substrate pad dimension
AM62A7 / AM62A7-Q1 -> AMB pkg : ball diameter 0.5mm : substrate pad 0.45mm
The recommendation is 1:1 ratio between PCB pad and substrate pad.
DDR Board Design and Layout Guidelines
AM62Ax, AM62Px, AM62Dx LPDDR4 Board Design and Layout Guidelines
https://www.ti.com/lit/pdf/sprad66
Escape Routing for PCB Design
AM62Ax/AM62Dx Escape Routing for PCB Design
https://www.ti.com/lit/pdf/spruj81
Design Simulation files
https://www.ti.com/product/AM62A7#design-tools-simulation
Simulation files provided includes IBIS, IBIS-AMI, BSDL, Thermal model, power-estimation tool (PET) and SK-AM62A-LP Design File Package (Assembly drawing).
AM62Ax PDN Target impedance values:
Voltage Rail | Freq Range | Target Impedance (mOhms) |
VDD_CORE (0.75V) | Low (< 1MHz) | 7.0 |
Mid (1 - 20 MHz) | 11.7 | |
High (20 - 50 MHz) | 23.4 | |
VDD_CORE (0.85V) | Low (< 1MHz) | 6.9 |
Mid (1 - 20 MHz) | 11.4 | |
High (20 - 50 MHz) | 22.9 | |
VDD_DDR (1.1V) | Low (< 1MHz) | 104.5 |
Mid (1 - 20 MHz) | 174.2 | |
High (20 - 50 MHz) | 348.3 |
Note: We do not include Buck output inductance in PDN simulations.
Note 1: For VDDS_DDR: we do not recommend using target impedance as the signoff..
Refer to the AM62Ax, AM62Px, AM62Dx LPDDR4 Board Design and Layout Guidelines which outlines all details of power aware SI/PI simulations that need to be run. The eye mask checks from these power aware simulations are the signoff.
Power Distribution Networks: Implementation and Analysis
Sitara Processor Power Distribution Networks: Implementation and Analysis
https://www.ti.com/lit/pdf/sprac76
High Speed Board design and Signal integrity simulation
https://www.ti.com/lit/pdf/spraar7
https://www.ti.com/lit/pdf/spracn9
SYSCONFIG
DDR subsystem register configuration tool
Technical Documents
Collaterals and application notes
https://www.ti.com/product/AM62A7#tech-docs
https://www.ti.com/product/AM62A7-Q1#tech-docs
Technical Support
AM62A7 / AM62A7-Q1 Custom board design - FAQs
Previous E2E threads - Keywords AM62Ax, AM62A7, AM62A7-Q1
Starting a new thread
Useful links
Notes
Hi Board designers,
Additional inputs:
Could you help to provide Pinmux excel file for AM62A?
SysConfig Tool export csv file does not list MUX Mode.
TDAV4VM provides MUX Mode
The Excel has been generated and is attached here.
Regards,
Sreenivasa
Hi Board designers,
Additional inputs FYI only
I am unable to find the information about ball material(with wt%) for AM62P52ASMSIAMHRQ1
in the latest datasheet.
Could you please share this information?
Sn wt%
Ag wt%
Cu wt%
Bi wt%
?? wt%
?? wt%
Please refer below inputs i received:
Solder ball is :
96.5% Sn
3.0% Ag
0.5% Cu
Ball Diameter 0.4mm
The information is expected to be published after the release of the product.
Regards,
Sreenivasa
Hi Board designers,
Additional inputs
Could you provide following information of our AM62A12AQMSIAMBRQ1?
1. BGA PAD Material
2. BGA solder Ball material.
3. IC Pad type, is it SMD or NSMD?
Below is the related info we're looking for.
AM62A74AUMSIAMBRQ1 - the below is it’s Quality, reliability & packaging data information
https://www.ti.com/quality-reliability-packaging-download/report?opn=AM62A74AUMSIAMBRQ1
AM62A12AQMSIAMBRQ1 - the same information could be used as it is likely that there is no difference between the 2 devices for the
Quality, reliability & packaging data information
We're asking about the IC's(SoC) PAD.
Please refer below
AM62A – AMB pkg
Regards,
Sreenivasa
Hi Board designers,
Inputs regarding Package shelf life
Please refer below links
https://www.ti.com/support-quality/quality-policies-procedures/product-shelf-life.html
https://www.ti.com/support-quality/faqs/product-shelf-life-faqs.html
https://www.ti.com/support-quality/reliability/reliability-home.html
https://www.ti.com/lit/an/spraby1a/spraby1a.pdf
https://www.ti.com/lit/pdf/snoa550
https://www.ti.com/lit/an/slva840/slva840.pdf
/cfs-file/__key/communityserver-discussions-components-files/791/Baking-Procedure.pdf
Regards,
Sreenivasa