Texas Instruments (TI) Processors support forum is an extensive online knowledge base where millions of technical questions and solutions are available 24/7. You can search processors content or ask technical support questions on Sitara™ processors, digital signal processors (DSP) and automotive processors. Find the right solution for your circuit design challenges by using our TI E2E™ support forums that are supported by thousands of contributing TI experts.
Frequent questions

  • [FAQ] SK-AM69: Booting from OSPI

    Part Number: SK-AM69 Other Parts Discussed in Thread: AM69 I followed the steps on Processor SDK Linux for AM69 to boot from OSPI on SK-AM69 and I see the following message upon boot: U-Boot SPL 2023.04-g756ba776d4 (Jul 13 2023 - 05:36:12 +0000) EEPROM…

  • [FAQ] AM62A7: How to Set the Minimum/Maximum Exposure Time and Analog Gain for 2A Algorithm?

    Part Number: AM62A7 I’ve just brought up a sensor for AM62A. Now I’m going to start image quality tuning. According to the AM6xA ISP Tuning Guide , the first thing is to set the minimum and maximum exposure time and analog gain for the 2A algorithm…

  • [FAQ] J721S2XSOMXEVM: Enable USB 2.0 Hub on J7200/J721S2/J784S4

    Part Number: J721S2XSOMXEVM How to enabled the USB 2.0 hub stack present on the common processor board with J7200/J721S2/J784S4 SOM.

  • [FAQ] TDA4VM: How to boot using initramfs

    Part Number: TDA4VM The default SDK uses full fledged file system on the SD card rootfs partition as file system. How to boot using initramfs?

  • [FAQ] RE: AM623: Package ALW contact pressure specification for thermopad

    In customer's current AM6232 design they have to use a heat sink on top of MPU. A “ThermoPad” is then used between the heat sink and AM6232. In order for this to work correctly, a certain amount of contact pressure is required. I don't…

  • [FAQ] AM623: Package ALW contact pressure specification for thermopad

    Part Number: AM623 Hi champs! In customer's current AM6232 design they have to use a heat sink on top of MPU. A “ThermoPad” is then used between the heat sink and AM6232. In order for this to work correctly, a certain amount of contact…

  • [FAQ] TDA4VM: Stream camera of 2 datatypes using 2 Capture nodes and 2 Graphs on the same csi-rx instance

    Part Number: TDA4VM How to Send a YUV input and a raw input from a sensor to the same CSI-RX instance at a time?

  • [FAQ] AM625/AM623 Custom board hardware design – Processor power-sequencing requirements for power-up and power-down

    Hi TI Experts, I have the below queries regarding SOC(Processor) power-sequencing requirements for power-up and power-down 1.Is there a recommended power sequence to be followed for power-up? 2.Is there a power supply ramp requirement to be followed…

  • [FAQ] DP83869-EP: Ethernet compliance Testing failure when interfaced to AM64x

    Part Number: DP83869-EP Other Parts Discussed in Thread: DP83869 Hi Team, I have a customer testing ethernet compliance 1G on the AM64x EVM. They have the same implementation on their custom board and seeing similar failures. There are some failures observed…

  • [FAQ] AM625/AM623 Custom board hardware design – Power sequencing between SOC (Processor) and the Attached devices (Fail-safe)

    Other Parts Discussed in Thread: AM625 , AM625-Q1 , AM620-Q1 , AM62A3 , AM62A7 , AM625SIP , AM623 Hi TI Experts, I have the below queries regarding Power supply sequencing between SOC (Processor) and the Attached devices Can I power the SOC (Processor) IOs…

View FAQ threads
  • Threads 189311 Discussions