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Frequent questions

  • [FAQ] TDA4AEN-Q1: Steps to Configure a Standalone C75x Application with SysConfig on J722S EVM

    Part Number: TDA4AEN-Q1 Other Parts Discussed in Thread: SYSCONFIG , AM67 , UNIFLASH , TDA4VEN-Q1 , MATHLIB , FFTLIB Hi Team, What are the steps required to set up SysConfig and configure a standalone C75x application on a J722S EVM? Regards, Shabary…

  • [FAQ] TDA4AEN-Q1: Steps to Flash and Boot a Standalone C75x Binary from OSPI NAND on J722S EVM

    Part Number: TDA4AEN-Q1 Other Parts Discussed in Thread: SYSCONFIG , UNIFLASH Hi Team, What are the steps required to flash and boot a standalone C75x application from the OSPI NAND on a J722S EVM? Regards, Shabary S Sundar

  • [FAQ] TDA4VM: How to use VPAC-LDC to upscale images? (TDA4x/AM6xA)

    Part Number: TDA4VM VPAC-LDC H/W can be used for simple image upscaling as well as downscaling, while VPAC-MSC only supports downscaling. To program LDC for upscaling, we need to reduce the affine transform matrix elements A and E from their default…

  • [FAQ] AM62Lx, AM62x, AM62Px, AM62Dx, AM62Ax, AM64x, AM243x : Sitara MPU GUI Based Tools

    Following is a consolidated list of all the tools currently available on the https://dev.ti.com/gallery/ The list continues to expand as we build self-helper tools on recurring challenges.

  • [FAQ] TDA4VH-Q1: How do I build firmware and replace it in a Yocto build?

    Part Number: TDA4VH-Q1 I have built specific firmwares for my applications, and I need to replace the firmware pulled into my Yocto build. How do I do this?

  • [FAQ] How to sign JTAG unlock certificate with the imported keyring key on AM6xx

    Part Number: AM625 SYSFW/TIFS supports keyring import on AM6xx SoC https://software-dl.ti.com/tisci/esd/latest/6_topic_user_guides/keyring.html https://software-dl.ti.com/tisci/esd/latest/2_tisci_msgs/security/keyring.html The imported key can be…

  • [FAQ] How to boot SK-AM62B via Ethernet

    Part Number: AM625 Other Parts Discussed in Thread: SK-AM62B This FAQ goes over how to boot the EVM into the u-boot environment via Ethernet, then fully boot the EVM with either DHCP/TFTP or eMMC. This FAQ is divided into 3 sections How to boot…

  • [FAQ] AM6442: Enabling SOP8 208mil and SOP16 300mil Co-Layout for Winbond Flash in a Single PCB Design

    Part Number: AM6442 Just a quick information share for anyone who may encounter a similar situation. I recently heard from a designer working on an AM6442-based project who faced a PCB layout challenge due to component sourcing flexibility requirements…

  • [FAQ] J784S4XEVM: RAT configuration for Jacinto platforms

    Part Number: J784S4XEVM RAT configuration from simple example

  • [FAQ] 3D CNN / Pooling TO 2D CONVERSION FOR TIDL

    Part Number: PROCESSOR-SDK-RTOS-J784S4 OVERVIEW TIDL's C7x DSP only runs 2D convolution and 2D pooling. This tool rewrites Conv3D, MaxPool3D, and AveragePool3D nodes in an ONNX model into equivalent sequences of 2D operations. The conversion is mathematically…

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