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Frequent questions

  • [FAQ] TDA4VH-Q1: Analysis on Latency Wave521CL CODEC IP

    Part Number: TDA4VH-Q1 What information is available of encoder/decoder latency on the Wave521CL CODEC IP?

  • [FAQ] AM6422: am64x internal clock as Ethernet PHY Clock source CLKOUT0 EXT_REFCLK1

    Part Number: AM6422 Other Parts Discussed in Thread: DP83867IR , SYSCONFIG Hello, I am working with the am64x and the industrial communication SDK. I am trying to run the ethercat_slave_beckhoff_ssc_demo. The development board I am using does not provide…

  • [FAQ] Board bring up tips for Sitara devices (AM64x, AM243x, AM62x, AM62L, AM62Ax, AM62D-Q1, AM62Px)

    Other Parts Discussed in Thread: AM625SIP , AM62D-Q1 , AM625 The page provides tips on debugging initialization and boot up issues with the following devices: AM64x AM243x AM62x/AM625SIP AM62Lx AM62Ax AM62D-Q1 AM62Px If this page doesn…

  • [FAQ] TDA4VM: How to address the assertion Issue from EthFw, due to race condition between multiple client requests for EnetMcm Module Server Task.

    Part Number: TDA4VM How to address the assertion Issue from EthFw, due to race condition between multiple client requests for EnetMcm Module Server Task.

  • [FAQ] AM625 / AM623 Custom board hardware design - Design and Review notes for Reuse of SK-AM62B Schematics

    Part Number: AM625 Other Parts Discussed in Thread: SK-AM62B , SK-AM62B-P1 , Hi TI Experts, I am starting a new board design and planning to use TI Starter Kit (SK) design files for designing my custom board. https://www.ti.com/tool/SK-AM62B …

  • [FAQ] AM6442: SERDES Common Mode Voltage, Seeing 400mv centerpoint in simulation

    Part Number: AM6442 Hello, I am trying to understand what voltage levels I am looking at with the AM6442 SERDES driver. I am using the IBIS-AMI model in HYPERLYNX I am seeing the common mode output voltage swing from 200 to 600 mV with a centerpoint…

  • [FAQ] AM6x: Optimizing SPI-transfer inter-byte gaps using the DMA in Linux

    Part Number: AM625 Other Parts Discussed in Thread: SK-AM62B , Overview In some applications it is critical that SPI transfers happen with the smallest-possible inter-byte gaps to either optimize throughout, or to meet certain overall system real…

  • [FAQ] AM6x: Using a custom device tree file for booting the Linux Kernel with TI's Yocto SDK v9.x

    Part Number: AM625 Other Parts Discussed in Thread: SK-AM62 , , SK-AM62B Overview It is a common need wanting to incorporate a custom Linux device tree file into the boot process of Yocto-generated filesystem images. This FAQ introduces a simple and…

  • [FAQ] AM623: LPDDR4 Padstack size

    Part Number: AM623 Hello, I'm referring to PROC124E2A AM62x-LOW POWER SKEVM, which uses MT53E1G16D1FW-046 WT:A LPDDR4. According to datasheet the size of the solderballs should be 0.436mm and PCB board uses 13mils(0.3302mm). Also, if you see the…

  • [FAQ] TDA4VL-Q1: CDD IPC App example running on MCU1_0 communicating with another R5 core

    Part Number: TDA4VL-Q1 Hello, Can you support in extending CDD IPC app example to run on MCU1_0 communicating with MCU2_0 core ? Regards

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