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Part Number: TDA4VH-Q1 Other Parts Discussed in Thread: TDA4VL , TDA4VM , TDA4VH
What data throughput can be achieved on TDA4 device in theory, and what throughput can be measured? And how to achieve measured throughput?
Part Number: TDA4AEN-Q1 Other Parts Discussed in Thread: SYSCONFIG , AM67 , UNIFLASH , TDA4VEN-Q1 , MATHLIB , FFTLIB
Hi Team, What are the steps required to set up SysConfig and configure a standalone C75x application on a J722S EVM?
Regards, Shabary…
Part Number: TDA4AEN-Q1 Other Parts Discussed in Thread: SYSCONFIG , UNIFLASH
Hi Team, What are the steps required to flash and boot a standalone C75x application from the OSPI NAND on a J722S EVM?
Regards, Shabary S Sundar
Part Number: TDA4VM
VPAC-LDC H/W can be used for simple image upscaling as well as downscaling, while VPAC-MSC only supports downscaling.
To program LDC for upscaling, we need to reduce the affine transform matrix elements A and E from their default…
Following is a consolidated list of all the tools currently available on the https://dev.ti.com/gallery/
The list continues to expand as we build self-helper tools on recurring challenges.
Part Number: TDA4VH-Q1
I have built specific firmwares for my applications, and I need to replace the firmware pulled into my Yocto build. How do I do this?
Part Number: AM625
SYSFW/TIFS supports keyring import on AM6xx SoC https://software-dl.ti.com/tisci/esd/latest/6_topic_user_guides/keyring.html https://software-dl.ti.com/tisci/esd/latest/2_tisci_msgs/security/keyring.html
The imported key can be…
