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Frequent questions

  • [FAQ] AM623: LPDDR4 Padstack size

    Part Number: AM623 Hello, I'm referring to PROC124E2A AM62x-LOW POWER SKEVM, which uses MT53E1G16D1FW-046 WT:A LPDDR4. According to datasheet the size of the solderballs should be 0.436mm and PCB board uses 13mils(0.3302mm). Also, if you see the…

  • [FAQ] TDA4VL-Q1: CDD IPC App example running on MCU1_0 communicating with another R5 core

    Part Number: TDA4VL-Q1 Hello, Can you support in extending CDD IPC app example to run on MCU1_0 communicating with MCU2_0 core ? Regards

  • [FAQ] TDA4AH-Q1: CDD IPC App example running on MCU1_0 communicating with another R5 core

    Part Number: TDA4AH-Q1 Hello, Can you support in extending CDD IPC app example to run on MCU1_0 communicating with MCU2_0 core ? Regards

  • [FAQ] AM6442: CLKOUT0 feedback to RMII_REF_CLK always necessary?

    Part Number: AM6442 Hello Sitara team, my customer is working with AM6442 and two Ethernet PHYs ADIN1200 (100Mbit) and ADIN1300 (1Gbit). They would like to use CLKOUT of the AM64 with 25MHz to connect to the 100Mbit PHY. However in the datasheet…

  • [FAQ] J721S2XSOMXEVM: How to unlock the JTAG using TISCI API ?

    Part Number: J721S2XSOMXEVM How we can unlock the JTAG on HS-SE devices using TISCI api mentioned in the secure debug document ?

  • [FAQ] AM625: [AM625 / AM623] - VPP use case ( Extended OTP and Customer (Security) Keys programming)

    Part Number: AM625 Hi TI team, I'm following instructions on VPP from this thread: https://e2e.ti.com/support/processors-group/processors/f/processors-forum/1220816/faq-am625-am623-am625sip-am625-q1-am620-q1-custom-board-hardware-design-queries…

  • [FAQ] PROCESSOR-SDK-AM57X: Is there a new AM57x SDK?

    Part Number: PROCESSOR-SDK-AM57X New Software update!

  • [FAQ] J722SXH01EVM: How to enable OSPI NAND & NOR boot on 9.2 Linux SDK

    Part Number: J722SXH01EVM By default the 9.2 SDK for J722S does not support OSPI NOR & NAND boot modes. How to enable them?

  • [FAQ] TDA4VL-Q1: How to Enable Additional I2C Bus Instances on QNX

    Part Number: TDA4VL-Q1 Other Parts Discussed in Thread: TCA6408 QNX/Blackberry delivers a BSP for the TI EVM. Depending on the TI EVM in use, in some case customers may want to enable additional I2C buses for access from A72 QNX. How can this be done…

  • [FAQ] AM6421: ETH PHYs: DP83867IRRGZT and DP83869HMRGZT - Magnetics

    Part Number: AM6421 We have used Ethernet PHYs DP83867IRRGZT and DP83869HMRGZT with processor AM6421BSFGHAALV. We followed reference design for AM64xx and used same PHYs as reference. We have used below RJ45 connector with inbuilt magnetics. MFR#…

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